Shankar Devasenathipathy
Shankar Devasenathipathy
Engineering Manager, Intel Corporation
Verified email at
Cited by
Cited by
Particle imaging techniques for microfabricated fluidic systems
S Devasenathipathy, JG Santiago, ST Wereley, CD Meinhart, K Takehara
Experiments in Fluids 34, 504-514, 2003
Experimental observation of induced-charge electro-osmosis around a metal wire in a microchannel
JA Levitan, S Devasenathipathy, V Studer, Y Ben, T Thorsen, TM Squires, ...
Colloids and Surfaces A: Physicochemical and Engineering Aspects 267 (1-3 …, 2005
Particle tracking techniques for electrokinetic microchannel flows
S Devasenathipathy, JG Santiago, K Takehara
Analytical chemistry 74 (15), 3704-3713, 2002
Electrokinetic flow diagnostics
S Devasenathipathy, JG Santiago
Microscale Diagnostic Techniques, 113-154, 2005
Experimental investigation of flow transition in microchannels using micron-resolution particle image velocimetry
R Zeighami, D Laser, P Zhou, M Asheghi, S Devasenathipathy, T Kenny, ...
ITHERM 2000. The Seventh Intersociety Conference on Thermal and …, 2000
Micro-and nano-scale diagnostic techniques
S Devasenathipathy, JG Santiago
Springer, New York, 2003
Investigation of internal pressure gradients generated in electrokinetic flows with axial conductivity gradients
S Devasenathipathy, R Bharadwaj, JG Santiago
Experiments in fluids 43, 959-967, 2007
A hybrid method for bubble geometry reconstruction in two-phase microchannels
EN Wang, S Devasenathipathy, H Lin, CH Hidrovo, JG Santiago, ...
Experiments in Fluids 40, 847-858, 2006
Thermal compression bonding process cooling manifold
H Dhavaleswarapu, Z Li, J Petrini, SB Roach, S Devasenathipathy, ...
US Patent 9,282,650, 2016
A study of the flow field in a model rotor-stator disk cavity
RP Roy, S Devasenathipathy, G Xu, Y Zhao
Turbo Expo: Power for Land, Sea, and Air 78606, V003T01A064, 1999
Thermal assemblies for multi-chip packages
Z Wan, JY Chang, CP Chiu, S Devasenathipathy, BK Gebrehiwot, CM Jha
US Patent 11,456,232, 2022
Stacked die architectures with improved thermal management
F Eid, S Kothari, CM Jha, JM Swan, MJ Baker, SM Liff, TL Sounart, ...
US Patent App. 15/866,793, 2019
Dual side die packaging for enhanced heat dissipation
Z Wan, S Devasenathipathy, CP Chiu, CM Jha, W Tang
US Patent App. 16/153,392, 2020
Separation technique of sub-micron particles using electrokinetically driven flow
T Yamamoto, S Devasenathipathy, Y Sato, K Hishida
Nippon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of …, 2004
Liquid velocity field measurements in two-phase microchannel convection
E Wang, S Devasenathipathy, CH Hidrovo, DW Fogg, JM Koo, ...
Proc. 3rd International Symposium on Two-Phase Flow Modeling and …, 2004
High performance transient uniform cooling solution for thermal compression bonding process
Z Li, HK Dhavaleswarapu, JB Petrini, S Devasenathipathy, SB Roach, ...
US Patent 9,434,029, 2016
Electrokinetic particle separation
S Devasenathipathy
Micro Total Anal. Syst. 2003, 845-848, 2003
Socket loading mechanism for passive or active socket and package cooling
SA Klein, Z Wan, CP Chiu, S Devasenathipathy
US Patent 11,646,244, 2023
Filled liquid metal thermal interface materials
KJ Arrington, A Mccann, K Lofgreen, AR Antoniswamy, ...
US Patent App. 16/662,562, 2021
Contact Pressure and Load Measurement Techniques for Applications in Semiconductor Packaging
S Yagnamurthy, S Klein, N Haehn, S Reynolds, T Harirchian, CP Chiu, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1019-1026, 2016
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