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Co-authors
- Yi CuiStanford UniversityVerified email at stanford.edu
- David T. BoyleGraduate Student, Stanford UniversityVerified email at stanford.edu
- William HuangArcher, Stanford UniversityVerified email at alumni.stanford.edu
- Jinwei XuUniversity of WashingtonVerified email at uw.edu
- Hong-Jie Peng (彭翃杰)University of Electronic Science and Technology of China or Tsinghua or Stanford or SLACVerified email at uestc.edu.cn
- Yuzhang LiAssistant Professor, Chemical and Biomolecular Engineering, University of California, Los AngelesVerified email at ucla.edu
- Jia-Qi Huang (黄佳琦)Beijing Institute of TechnologyVerified email at bit.edu.cn
- Qiang ZhangTsinghua UniversityVerified email at mails.tsinghua.edu.cn
- Rong Xu (许荣)Xi'an Jiaotong University, Stanford University, Purdue UniversityVerified email at mail.xjtu.edu.cn
- Yangying ZhuUCSBVerified email at ucsb.edu
- Ge ZhangPostdoc, Stanford UniversityVerified email at stanford.edu
- Allen PeiTesla, Stanford University, UC San DiegoVerified email at tesla.com
- Zhiyi LuNingbo Institute of Materials Technology&Engineering, CASVerified email at nimte.ac.cn
- Xiang Chen (陈翔)Department of Chemical Engineering, Tsinghua UniversityVerified email at mails.tsinghua.edu.cn
- Bo-Quan Li(李博权)Beijing Institute of TechnologyVerified email at bit.edu.cn
- Xin-Bing ChengTsinghua University, ChinaVerified email at mails.tsinghua.edu.cn
- Meng Zhao (赵梦)Tsinghua UniversityVerified email at mail.tsinghua.edu.cn
- Steven ChuProf.Verified email at stanford.edu
- Hansen WangTsinghua University, Stanford University, Contemporary Amperex Technology Co., Limited (CATL)