| Mechanically robust nanoparticle stabilized transparent liquid marbles PS Bhosale, MV Panchagnula, HA Stretz Applied Physics Letters 93 (3), 2008 | 161 | 2008 |
| On synthesizing solid polyelectrolyte microspheres from evaporating liquid marbles PS Bhosale, MV Panchagnula Langmuir 26 (13), 10745-10749, 2010 | 55 | 2010 |
| Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node T Nogami, X Zhang, J Kelly, B Briggs, H You, R Patlolla, H Huang, ... 2017 Symposium on VLSI Technology, T148-T149, 2017 | 26 | 2017 |
| Sweating liquid micro-marbles: dropwise condensation on hydrophobic nanoparticulate materials PS Bhosale, MV Panchagnula Langmuir 28 (42), 14860-14866, 2012 | 25 | 2012 |
| Electroacoustics of particles dispersed in polymer gel PS Bhosale, J Chun, JC Berg Langmuir 27 (12), 7376-7379, 2011 | 22 | 2011 |
| Poly (acrylic acid) as a rheology modifier for dense alumina dispersions in high ionic strength environments PS Bhosale, JC Berg Colloids and surfaces A: physicochemical and engineering aspects 362 (1-3 …, 2010 | 21 | 2010 |
| Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study NA Lanzillo, OD Restrepo, PS Bhosale, E Cruz-Silva, CC Yang, ... Applied Physics Letters 112 (16), 2018 | 20 | 2018 |
| A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects T Zhou, NA Lanzillo, P Bhosale, D Gall, R Quon Aip Advances 8 (5), 2018 | 19 | 2018 |
| Acoustic spectroscopy of colloids dispersed in a polymer gel system PS Bhosale, JC Berg Langmuir 26 (18), 14423-14426, 2010 | 18 | 2010 |
| Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines T Nogami, R Patlolla, J Kelly, B Briggs, H Huang, J Demarest, J Li, ... 2017 IEEE International Interconnect Technology Conference (IITC), 1-3, 2017 | 17 | 2017 |
| Bottom electrode for MRAM applications P Bhosale, RR Patlolla, M Rizzolo, CC Yang US Patent 10,096,769, 2018 | 16 | 2018 |
| Advanced BEOL interconnects T Nogami, O Gluschenkov, Y Sulehria, S Nguyen, H Huang, NA Lanzillo, ... 2020 IEEE International Interconnect Technology Conference (IITC), 1-3, 2020 | 12 | 2020 |
| Electrophoretic mobility of poly (acrylic acid)-coated alumina particles PS Bhosale, J Chun, JC Berg Journal of colloid and interface science 358 (1), 123-128, 2011 | 12 | 2011 |
| The dynamics of polymer bridge formation and disruption and its effect on the bulk rheology of suspensions PS Bhosale, JC Berg Langmuir 28 (49), 16807-16811, 2012 | 11 | 2012 |
| Area-selective deposition of tantalum nitride with polymerizable monolayers: from liquid to vapor phase inhibitors K Lionti, N Arellano, N Lanzillo, S Nguyen, PS Bhosale, H Bui, T Topuria, ... Chemistry of Materials 34 (7), 2919-2930, 2022 | 10 | 2022 |
| Spin-dependent electron scattering in cobalt interconnects NA Lanzillo, P Bhosale, C Lavoie, DJ Dechene, RR Robison, K Choi Journal of Physics D: Applied Physics 52 (49), 495302, 2019 | 10 | 2019 |
| Technology challenges and enablers to extend Cu metallization to beyond 7 nm node T Nogami, H Huang, H Shobha, R Patlolla, J Kelly, C Penny, CK Hu, D Sil, ... 2019 Symposium on VLSI Technology, T18-T19, 2019 | 7 | 2019 |
| Modified ALD TaN barrier with Ru liner and dynamic Cu reflow for 36nm pitch interconnect integration PS Bhosale, J Maniscalco, N Lanzillo, T Nogami, D Canaperi, ... 2018 IEEE International Interconnect Technology Conference (IITC), 43-45, 2018 | 7 | 2018 |
| Interconnect with self-forming wrap-all-around barrier layer H Huang, T Nogami, A Grill, BD Briggs, NA Lanzillo, C Lavoie, D Sil, ... US Patent 10,978,342, 2021 | 6 | 2021 |
| Skip via for metal interconnects HP Amanapu, P Bhosale, NV LiCausi, LW Liebmann, JJ McMahon, ... US Patent 10,978,388, 2021 | 6 | 2021 |
