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Co-authors
Juan G. SantiagoProfessor, Mechanical Engineering, Stanford UniversityVerified email at stanford.edu- Brian D. StoreyToyota Research InstituteVerified email at tri.global
- Jianboi LiThree Bridges CaptialVerified email at threebridgesCap.com
- Huiling Duan (段慧玲)Peking UniversityVerified email at pku.edu.cn
- Yahui Xue （薛亚辉）Associate Professor at Southern University of Science and TechnologyVerified email at sustech.edu.cn
- Chuan-Hua ChenAssociate Professor of Mechanical Engineering, Duke UniversityVerified email at duke.edu
- Jingang YiProfessor, Department of Mechanical and Aerospace Engineering, Rutgers UniversityVerified email at rutgers.edu
- Rumiana DimovaGroup leader, Max Planck Institute of Colloids and Interfaces, Potsdam, GermanyVerified email at mpikg.mpg.de
- Chang LuFred W. Bull Professor of Chemical Engineering, Virginia Tech, BlacksburgVerified email at vt.edu
- Evelyn N WangMechanical Engineering, MITVerified email at mit.edu
- Zhenhua, XiaZhejiang UniversityVerified email at pku.edu.cn
- David RossPhysicist, National Institute of Standards and TechnologyVerified email at nist.gov
- Ceji FuAssociate Professor, College of Engineering, Peking UniversityVerified email at pku.edu.cn
- Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial ProfessorVerified email at stanford.edu
- Shankar DevasenathipathyEngineering Manager, Intel CorporationVerified email at asu.edu
- Thomas KennyProfessor of Mechanical Engineering, Stanford UniversityVerified email at cdr.stanford.edu
- Carlos HidrovoAssociate Professor of Mechanical Engineering, Northeastern UniversityVerified email at northeastern.edu
- Philip MarcusProfessor of Mechanical Engineering, University of California at BerkeleyVerified email at me.berkeley.edu
- German DrazerMechanical and Aerospace Engineering, Rutgers, The State University of New JerseyVerified email at rutgers.edu
- Yanyi HuangProfessor at Peking UniversityVerified email at pku.edu.cn
